Services & Solutions Printed Circuit Board Assembly
Materials Management
Value Chain
Program Management
Limited Component Sales
Surface Mount Technology / PTH
  • Fuji CP-IV,IP-II,GL-V,GSP-III
  • Zevatech 730,740
  • Reflow Conceptronic, BTU
  • Single and double-sided product
  • 0.4mm (16 mil) pitch
  • Aqueous clean process
  • No clean process
  • 0402 series passive component
  • Universal DIP,VCD & Sequencer
  • Wave-Sensbey & Electrovert
  • DIP,SIP,VCD,ZIP and radials

Fuji SMT Line

HP 3070 series II
In-circuit, Functional, Burn-in
  • HP 3070 series II/III
  • Teradyne FlyingProbe
  • X-TEK Revolution
  • 3D X-ray Inspection
  • In-circuit Test
  • Functional Test
  • Burn-in Testing

X-TEK REVOLUTION
Fixture, Tooling, ICT, Design
  • Fixture and tooling development
  • ICT & functional test development
  • Design for manufacturability
  • Design for testability
  • Manufacturing process instruction

Agilent 3070 series III

Teradyne Flying Probe
Ball Grid Array
  • Nicolet X-ray inspection
  • SRT BGA Rework machine
  • CBGA Ceramic
  • PBGA Plastic
  • TBGA Tape


SRT BGA Rework Machine

  • Leveraged Purchasing Power
  • Supply Chain Management
  • Strategic Supplier Alliances
  • Inventory Optimization Plans
  • Customized Logistics Management Programs
  • Ship-to-Stock Programs
  • Off Shore Procurement Office

  • Design to Product Specification
  • DFM / DFT
  • Quick Turn Prototype
  • PCBA
  • System Integration
  • ICT Program Optimization
  • Order Fulfillment and Distribution

  • Technically skilled - A single point of contact to address customer concerns
  • Provides coverage for all program aspects
  • Ensures Successful Execution of Customer Requirements

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