Services & Solutions	Printed Circuit Board Assembly Materials Management Value Chain Program Management Limited Component Sales
Surface Mount Technology / PTH Fuji CP-742E, 65, 643E, IP III, GSM II. Zevatech 730,740 Reflow Conceptronic, BTU Single and double-sided product 0.4mm (12 mil) pitch Aqueous clean process No clean process 0201 series passive component Universal DIP,VCD & Sequencer Wave-Sensbey & Electrovert DIP,SIP,VCD,ZIP and radials	Fuji SMT Line
HP 3070 series II	In-circuit, Functional, Burn-in TRI AOI Test HP 3070 series II/III In-circuit Test Teradyne FlyingProbe TEK X-Ray Inspection Functional Test Burn-in Testing
X-TEK REVOLUTION	Fixture, Tooling, ICT, Design Fixture and tooling development ICT & functional test development Design for manufacturability Design for testability Manufacturing process instruction
Agilent 3070 series III	Teradyne Flying Probe
Ball Grid Array Conceptronic BGA Rework Station SRT BGA Rework Station CBGA Ceramic PBGA Plastic TBGA Tape	SRT BGA Rework Machine
Leveraged Purchasing Power Supply Chain Management Strategic Supplier Alliances Inventory Optimization Plans Customized Logistics Management Programs Ship-to-Stock Programs Off Shore Procurement Office
Design to Product Specification DFM / DFT Quick Turn Prototype PCBA System Integration ICT Program Optimization Order Fulfillment and Distribution
Technically skilled - A single point of contact to address customer concerns Provides coverage for all program aspects Ensures Successful Execution of Customer Requirements

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